6th International Conference on Microbiome Engineering December 8-10, 2023 International House at UC Berkeley, Berkeley, California, USA
7th CCPS Global Summit on Process Safety November 27-29, 2023 Arcrea HIMEJI (Himeji Culture and Convention Center), Himeji City Hyogo Prefecture
6th International Conference on Microbiome Engineering December 8-10, 2023 International House at UC Berkeley, Berkeley, California, USA
Archived Webinar Want to be an Entrepreneur? Personal Stories From Three Successful Entrepreneurs Who Have Traveled This Path.
Hailey Loehde-Woolard Citation name Loehde-Woolard, H. Affiliation CU Boulder State CO Country USA Authored(70d) Molecular Layer Deposition of Amine-Functional Groups on Fumed Silica Nanoparticles for CO2 CaptureHailey Loehde-WoolardAnnika LaiAlan WeimerRobert Pfeffer2020 Virtual AIChE Annual Meeting (ISBN: 978-0-8169-1114-1)(516g) CO2 Capture Using MLD-Modified High Surface Area Fumed Silica SubstratesHailey Loehde-WoolardAnnika LaiRobert PfefferAlan Weimer2020 Virtual AIChE Annual Meeting (ISBN: 978-0-8169-1114-1)(634a) Supported Amine Adsorbents for CO2 Capture Via Particle Molecular Layer DepositionHailey Loehde-WoolardAnnika LaiWilliam McNearyJessica BurgerRobert PfefferAlan Weimer2021 Annual Meeting (ISBN: 978-0-8169-1116-5)(513e) CO2 Capture Using Amine-Functionalized Fumed Silica Via Molecular Layer DepositionHailey Loehde-WoolardAnnika LaiWilliam McNearyJessica BurgerRobert PfefferAlan Weimer2021 Annual Meeting (ISBN: 978-0-8169-1116-5)(407c) Direct Ink Writing of Tungsten and Tungsten Alloys for Dense Complex ShapesHailey Loehde-WoolardElena NapoletanoDavis R. ConklinBergen EvansJames SmayAlan Weimer2022 Annual Meeting (ISBN: 978-0-8169-1118-9)(536l) Manufacture of Complex-Shaped Tungsten Materials Via Atomic Layer Deposition and Direct Ink WritingHailey Loehde-WoolardElena NapoletanoDavis R. ConklinBergen EvansJames SmayAlan Weimer2022 Annual Meeting (ISBN: 978-0-8169-1118-9) Associated proceedings 2020 Virtual AIChE Annual Meeting 2021 Annual Meeting 2022 Annual Meeting
