Master Bond Polymer System EP30D-7

Combining the benefits of epoxy resins and polyurethanes, the Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance and toughness. This two-component epoxy is ideal for bonding, sealing, coating and encapsulating in a variety of chemical process applications. Its lower exotherm also makes it suitable for casting and potting in cross-section thicknesses of over one inch. Serviceable over the wide temperature range of –100°F to above 250°F, EP30D-7 is designed to cure at room temperature (or more rapidly at elevated temperatures) with minimal shrinkage. The system is 100% reactive and contains no solvents or diluents. The material has a tensile strength above 1,600 psi, a Shore A hardness of 90, an elongation of more than 40%, and a dielectric constant exceeding 400 V/mL.