KER line of silicone die-bond materials

The KER line of silicone die-bond materials provides excellent encapsulating performance for high-brightness light emitting diodes (HBLEDs). Comprised of three key single-component, heat-cured products, the diverse series covers a broad spectrum of silicone polymer chemistry and structural composition. This makes the products particularly useful for numerous demanding HBLED packaging applications. The KER series is available in clear, opaque, and white thin-bond-line versions to minimize light absorption and maximize heat dissipation. Applications range from display equipment to backlight sources. The KER-3000-M2 formulation is nearly transparent and has excellent transmittance of UV light. The KER-3100-U2 material offers high covering power, high light reflectivity, low thermal resistance, and excellent thermal conductivity. The KER-3200-T1 adhesive has low thermal resistance and experiences little discoloration due to heat and light.