EP29LPSP epoxy adhesive/sealant

EP29LPSP is a two-component epoxy adhesive/sealant designed to be used in cryogenic applications. It can withstand temperatures as low as 4 K and resist cryogenic shocks (e.g., going from room temperature down to liquid helium temperatures in a 5–10 min period). This adhesive has a mix ratio of 100:65 by weight and cures at room temperatures with a low exotherm, but best results are obtained if heat-cured at 130–165ºF for 6–8 h. It features superior physical strength properties and excellent chemical resistance, and when mixed, has a viscosity of 400 cP, a tensile strength of 6,500 psi, and a tensile modulus above 375,000 psi. When cured, it is an excellent insulator, with volume resistivity of >1,015 ohm-cm, a dielectric constant of 3.6. and Shore D hardness of 80. This optically clear adhesive is available in syringe applicators and in pint, quart, 1-gal and 5-gal kits.