Pioneer 300 Automated Wafer Surface Analyzer

The fully automated Pioneer 300 is specifically designed for use in 300-mm semiconductor wafer processing. It provides quick and accurate contact angle/surface energy measurements of the wafer surface for adhesion, cleanliness and surface treatments. The system is designed to prevent particulate formation or contamination. It can be used to monitor the ultra-clean surface processing of silicon wafers. The position of the sample stage is computer-controlled and can be precisely adjusted along the x-, y- or z-axis. The user can easily control the position of the stage to allow for wafer surface mapping. The instrument uses a micro-pump controlled by a PC for precise and repeatable liquid drop formation and application. This insures that a reproducible drop volume is applied to the surface.