A flexible, tough epoxy-potting and encapsulation compound that is easily applied, EP30FL has extraordinarily low viscosity and superior electrical insulation properties. It can be used in both thick and thin cross-sections. This compound is 100% reactive and does not contain any volatiles. It generates low exotherms during curing even though it cures relatively quickly at room temperature. Shrinkage upon curing is exceptionally low. It has excellent adhesion to both similar and dissimilar substrates. Suitable for use in environments that are exposed to thermal cycling, it can withstand mechanical shock and vibration. It is available in 1/2-pint, pint, quart, gallon and 5-gal pail kits.
Company
Master Bond, Inc.