(351g) Computational Modeling of a Microchannel Cold Plate: Pressure, Velocity, and Temperature Profiles
Computational Modeling of a Microchannel Cold Plate: Pressure, Velocity, and Temperature Profiles
Javier A. Narvaez (1, 3), Robert J. Wilkens (1), Markus Rumpfkeil (2), and Hugh Thornburg (3)
(1) Chemical and Materials Engineering, University of Dayton, Dayton, OH; (2) Mechanical and Aeronautic Engineering, University of Dayton; (3) Wright-Patterson Air Force Base
The development of devices of increased power density – that is, with enhanced cooling capability per unit area – is a relevant problem in thermal management. It is highly desirable that these devices cool hot surfaces as uniformly as possible. A non-uniform temperature distribution may cause several problems, such as deterioration of the material being cooled down or degradation or boiling of the coolant or fluid being heated up. In this paper the pressure, velocity, and temperature profiles inside a Lytron CP20 microchannel cold plate under constant heat flux and cooled by DI water is simulated. The objective of this study is to evaluate the uniformity of temperature profile inside the cold plate. The problem is modeled using Star CCM+ software. The Reynolds-Average Navier-Stokes (RANS) model coupled with the 2-layer realizable kappa-epsilon model as the closure was used for this simulation. Critical details on the way modeling was performed and on the limitations of the model used are also discussed. Results from simulation are compared to experimental results: the pressure, velocity, and temperature at the inlet and outlet of the cold plate and the wall temperature at some points are experimentally measured and contrasted with respective results from simulation. Regions of especially high or low temperature are highlighted and discussed.