5th Engineering Cosmetics and Consumer Products Conference April 22-24, 2024 Le Méridien Philadelphia, Philadelphia, Pennsylvania, USA
5th Engineering Cosmetics and Consumer Products Conference April 22-24, 2024 Le Méridien Philadelphia, Philadelphia, Pennsylvania, USA
2024 Pacific Northwest Student Regional Conference April 26-27, 2024 University of Idaho, Moscow, ID, USA
CCPS Middle East Regional Meeting April 30, 2024 SIPCHEM R&D Center (MANAR), Dhahran Techno Valley, Saudi Arabia
Archived Webinar Want to be an Entrepreneur? Personal Stories From Three Successful Entrepreneurs Who Have Traveled This Path.
Jae Jeong Kim Citation name Kim, J. J. Affiliation Seoul National University Country Korea, Republic of (South) Authored(588d) Additives Applied to Cu ElectrodepositionJae Jeong Kim2019 AIChE Annual Meeting (ISBN: 978-0-8169-1112-7)(151c) Pretreatment and Copper Ion Diffusivity Optimization in High Speed Cu Pillar Electroplating for CMOS PackagingJae Jeong KimSoo woong Park2023 AIChE Annual Meeting (ISBN: 978-0-8169-1120-2)(151d) Study on the Mechanism of SPS with Chloride Ion during Cu Microvia Pulse-Reverse ElectrodepositionHui ju SeoJae Jeong Kim2023 AIChE Annual Meeting (ISBN: 978-0-8169-1120-2) Associated proceedings 2019 AIChE Annual Meeting 2023 AIChE Annual Meeting
