(92f) Investigation of Traditional and Novel Techniques for Cooling In High Heat Flux Microelectronics Applications
- Conference: AIChE Spring Meeting and Global Congress on Process Safety
- Year: 2011
- Proceeding: 2011 Spring Meeting & 7th Global Congress on Process Safety
- Group: Process Development Division
- Time: Wednesday, March 16, 2011 - 9:20am-9:45am
The growing demand for electronic devices to be smaller and faster has increased the energy released by these devices in the form of heat. Devices such as laptop computers are not exempted from these demands. The primary traditional technologies currently used to remove heat generated in these devices are fins and fans. Fins dissipate heat through contact with the surface area of a thermally conductive material like aluminum or copper. Fans dissipate heat through air convection. The objective of this study is to perform benchmarking experiments of traditional technologies and to compare the results with more novel technologies like the use of micro channels with water as the cooling fluid. Results are forthcoming.