(189bm) Measurement of the Liquid Thermal Conductivity of HFO-1336mzz(Z)(cis-1,1,1,4,4,4-hexafluoro-2-butene) By Transient Hot-Wire Method

Authors: 
Qiu, S. - Presenter, Xi'an Jiaotong University
Wang, X., Xi'an Jiaotong University
Wu, J., Xi'an Jiaotong University
With the increasingly prominent environmental problems, the HCFCs refrigerants are now being accelerated eliminated, and all of them have been banned and gradually replaced by the refrigerants with zero ozone depletion potential (ODP). As one of the hot topics in the field of refrigeration and air conditioning, the development of zero ODP and low Global Warming Potential (GWP) environmental refrigerants has become an urgent problem in the refrigeration and HVAC industry, and has been widely concerned by scholars both at home and abroad. Hydrofluoroolefins (HFOs) are considered as the new generation of refrigerants and working fluids because of their zero ODP and low GWP. HFO-1336mzz(Z) (cis-1,1,1,4,4,4-hexafluoro-2-butene, cis-CF3CH=CHCF3, CAS NO.692-49-9) has been discussed recently because of its nonflammability and low GWP value. In addition, HFO-1336mzz(Z) has excellent thermodynamic and chemical stability which is considered as a potential working fluid for various applications, including high temperature heat pumps, Organic Rankine Cycles and commercial chillers. Furthermore, HFO-1336mzz(Z) can also be used as foaming agent, extinguishing agent and solvent. In the existing literature, the thermal conductivity data of HFO-1336mzz(Z) are very few. Accordingly, in this work, the thermal conductivity of HFO-1336mzz(Z) for the compressed liquid phase were measured using the transient hot-wire thermal conductivity measurement equipment and basing on the Wheatstone bridge over the temperature range of (270 to 440)K with pressures up to 10 MPa. The transient hot-wire device was used to obtain high quality data for the thermal conductivity to help improve the design and operating costs of equipment item such as heat exchangers and provide reference for the other engineering application.