(398bo) Functionalized Graphene/Polyimide Thermal Conductivity Composites Via Electrospinning-Hot Press Technique

Highly thermally conductive polymeric composites as heat transfer materials are urgently needed in electronic fields. In our present work, the combining method of aminopropyllsobutyl polyhedral oligomeric silsesquioxane (NH₂-POSS) and hydrazine monohydrate was introduced to functionalize the surface of graphene oxide (GO), finally to obtained the chemical modified graphene (CMG), which was then performed to fabricate the corresponding thermally conductive CMG/polyimide (CMG/PI) composites via in-situ polymerization followed by electrospinning-hot press technique. Both the thermally conductive coefficient (λ) and the glass transition temperature (T_g) of the CMG/PI composites were increased with the increasing addition of CMG. The λ of the CMG/PI composite with 5 wt% CMG was significantly improved to 1.05 W/mK, 4 times higher than that of pristine PI (0.28 W/mK), and the corresponding T_g was also increased to 213^oC. Meantime, the obtained CMG/PI composites also presented excellent thermal stabilities. Our work provides great potential for electronic systems, expected to realize the heat transfer by electronic components, thus to prolong service life and avoid electronic components’ damage.

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