(609c) Chemical Mechanical Polishing of Oxide Layers Using Novel Ceria-Polymer Microcomposites

To meet the stringent requirements of device integration and manufacture, surface defects and mechanical stresses that arise during chemical mechanic planarization (CMP) must be reduced. Towards this end, we have synthesized multiple hybrid and composite particles on micron length scales consisting of siloxane co-polymers functionalized with inorganic nanoparticles. The size, texture and surface roughness of these particles can be easily tailored during synthesis, leading to softer or harder abrasion when desired. In using these particles for the planarization of silicon oxide wafers, we report the development of very smooth surfaces with reduced scratches and minimal particle deposition. This is an improvement from conventional abrasive materials like pure silica, ceria and alumina nanoparticle slurries. Tribological characteristics were examined using a bench top CMP tester to evaluate the in situ co-efficient of friction. Characterization of the hybrid and composite particles has been done using infrared spectroscopy, dynamic light scattering, and electron microscopy. Surface roughness of the wafers was examined using atomic force and optical microscopy while removal rate measurements were conducted using ellipsometry at multiple angles.