Kanwal Jit Singh graduated from Cornell University with a Doctorate in physical organic chemistry where his research focus was the kinetic and mechanistic understanding of organolithium solvation and aggregation. In 2006, he joined the Components Research organization at Intel Corporation in the Advanced Etch and Cleans group. Dr. Singh’s current research at Intel straddles the multidisciplinary fields of chemistry, materials science and fluid dynamics. He investigates and develops novel cleans formulations capable of removing lithography anti-reflective coatings, resists, sacrificial materials and post-etch polymeric residues with selectivity towards various classes of low-k dielectrics, hardmasks, and interconnect metals. In 2013, Dr. Singh was awarded the prestigious Intel Achievement Award for demonstration of novel interconnect materials which enabled aggressive density scaling at the 10 nm node. Dr. Singh chairs Intel’s reliability, back-end processes and interconnects strategic research sector which is responsible for fostering world class external collaborations. He has been an active participant in University collaborations in various roles as mentor, liaison and guide.