Master Bond, Inc.

Master Bond UV16
A combination of superior physical strength and cure rates faster than those of competing epoxy adhesives makes Master Bond UV16 suitable for demanding bonding, sealing, and coating applications. The standard formulation has a viscosity of 200–400 cP, and a higher-viscosity version (UV16TK) is also available. A reactive epoxy, UV16 is uninhibited by oxygen, and does not release any solvents or volatiles during curing. It adheres well to a wide array of substrates, including many plastics, metals, and glass. It will cure with thicknesses up to 0.125 in., and its 2–3% shrinkage rate is lower than that of most free-radical UV adhesives. Once cured, its tensile strength exceeds 4,100 psi and its Shore D hardness is over 75. Post-curing UV16 to 125°F for 30 minutes gives the adhesive a glass transition temperature of 135°F and enhanced chemical resistance, especially against acids and solvents.

EP42HT-2FG food-grade epoxy system
The new EP42HT-2FG food-grade epoxy system may be used in a wide variety of applications in the food industry, such as bonding and sealing metals, plastics, rubbers, and other substrates commonly found on food service equipment. The epoxy meets the stringent requirements of FDA CFR 175.300, as well as the NSF/ANSI 51.4.1 (2009) standard for food equipment materials. It features high resistance to chemicals and many solvents, as well as boiling water, fats, and oils, and may be readily used as a coating for storage tanks, bins, hoppers, and other containment vessels. EP42HT-2FG resists steam and radiation, and can withstand extreme temperatures over the range of –60°F to 450°F. It has a volume resistivity of over 1,014 ohm-cm and serves as a potting and encapsulation compound for electronic components and devices. The adhesive has a tensile strength greater than 12,000 psi and a tensile lap shear strength exceeding 2,000 psi at 75°F. It is available in half-pint, pint, quart, gallon, and five-gallon containers, and has a shelf life of one year when stored at room temperature in its original unopened container.

Master Bond Polymer System EP30D-7
Combining the benefits of epoxy resins and polyurethanes, the Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance and toughness. This two-component epoxy is ideal for bonding, sealing, coating and encapsulating in a variety of chemical process applications. Its lower exotherm also makes it suitable for casting and potting in cross-section thicknesses of over one inch. Serviceable over the wide temperature range of –100°F to above 250°F, EP30D-7 is designed to cure at room temperature (or more rapidly at elevated temperatures) with minimal shrinkage. The system is 100% reactive and contains no solvents or diluents. The material has a tensile strength above 1,600 psi, a Shore A hardness of 90, an elongation of more than 40%, and a dielectric constant exceeding 400 V/mL.

Polymer Supreme 46HT-2
Polymer Supreme 46HT-2 is a two-component adhesive that provides high-temperature resistance along with superior toughness and strength. Its mixing ratio is 100:30, and it cures at 250°F. Having a wide operating temperature range (–100°F–500°F), it is appropriate for many applications and is used in the aerospace, electronics, metalworking, transportation, appliance manufacturing, and chemical and oil processing industries. It is available for purchase in half-pint, pint, quart, one-gallon and five-gallon container kits.

MasterSil 151 MED
MasterSil 151 MED is a medical-grade potting and encapsulation silicone that is formulated to withstand vibration, impact, shock and thermal cycling. This two-component material cures at room temperature (more quickly at elevated temperatures), with cure shrinkage less than 0.1%, a Shore A hardness of 45, and an elongation-at-break of 160%. It cures optically clear with a refractive index of 1.43, making it well-suited as a protective coating in optical and fiber-optic applications. Its low viscosity of 1,500 cP makes it suitable for applications with complicated contours in complex configurations. It is an excellent electrical insulator with a volume resistivity of 1E15 ohm-cm and can withstand temperatures from –65°F to +400°F. Its tensile strength is 880 psi at 73°F and its mix ratio is 10:1 by weight. It meets U.S. Pharmacopeia (USP) Class VI requirements for medical applications.

EP46HT-1
EP46HT-1 is an electrical insulator that has excellent adhesion to metals, glass, vulcanized rubber, and most plastics, and offers excellent physical strength and chemical resistance. It is easy to apply and cures rapidly at elevated temperatures. It can tolerate a constant temperature up to 550°F, and intermittent exposures of up to 600°F, including severe and repeated thermal cycling. It is 100% reactive and does not contain any solvents or diluents.

EP19HT adhesive/sealant
The EP19HT adhesive/sealant is a storage-stable, single-component, low-viscosity system that cures readily at elevated temperatures to a tough, chemical-resistant, clear amber thermoset plastic. It contains no solvents or diluents, and cures in 1 h at 250°F; cure time can be reduced by raising the temperature to 325–350_ F. The material has a viscosity of 500–600 cP at 75°F, a volume resistivity of more than 1,015 Ω-cm, a tensile strength exceeding 10,000 psi, and a heat deflection temperature of more than 280_ F. With a service operating temperature range of –60°F to 400°F and excellent resistance to water, inorganic acids, bases, salts and many organic solvents, it is suitable for use as an adhesive in electronic/electrical applications, as a chemically resistant liner, and in providing sealing porosity in graphite. 

UV10MED adhesive
UV10MED is a one-component, low-viscosity, optically clear, UV curable adhesive that is USP Class VI approved and recommended for use in medical device manufacturing. It offers excellent adhesion to metals, glass, ceramics and most plastics, as well as superior chemical resistance properties to many types of sterilants. This adhesive is 100% reactive and does not contain solvents or other volatiles. It has a service temperature range of –60ºF to 250ºF, and cures quickly when exposed to UV light, with typical cure times ranging from 5–10 s to 2–3 min at ambient temperatures. The adhesive has a tensile strength of over 4,000 psi and a Shore D hardness over 60, as well as elongation under 5%. is a one-component, low-viscosity, optically clear, UV curable adhesive that is USP Class VI approved and recommended for use in medical device manufacturing. It offers excellent adhesion to metals, glass, ceramics and most plastics, as well as superior chemical resistance properties to many types of sterilants. This adhesive is 100% reactive and does not contain solvents or other volatiles. It has a service temperature range of –60ºF to 250ºF, and cures quickly when exposed to UV light, with typical cure times ranging from 5–10 s to 2–3 min at ambient temperatures. The adhesive has a tensile strength of over 4,000 psi and a Shore D hardness over 60, as well as elongation under 5%.

EP29LPSP epoxy adhesive/sealant
EP29LPSP is a two-component epoxy adhesive/sealant designed to be used in cryogenic applications. It can withstand temperatures as low as 4 K and resist cryogenic shocks (e.g., going from room temperature down to liquid helium temperatures in a 5–10 min period). This adhesive has a mix ratio of 100:65 by weight and cures at room temperatures with a low exotherm, but best results are obtained if heat-cured at 130–165ºF for 6–8 h. It features superior physical strength properties and excellent chemical resistance, and when mixed, has a viscosity of 400 cP, a tensile strength of 6,500 psi, and a tensile modulus above 375,000 psi. When cured, it is an excellent insulator, with volume resistivity of >1,015 ohm-cm, a dielectric constant of 3.6. and Shore D hardness of 80. This optically clear adhesive is available in syringe applicators and in pint, quart, 1-gal and 5-gal kits.

EP30FL
A flexible, tough epoxy-potting and encapsulation compound that is easily applied, EP30FL has extraordinarily low viscosity and superior electrical insulation properties. It can be used in both thick and thin cross-sections. This compound is 100% reactive and does not contain any volatiles. It generates low exotherms during curing even though it cures relatively quickly at room temperature. Shrinkage upon curing is exceptionally low. It has excellent adhesion to both similar and dissimilar substrates. Suitable for use in environments that are exposed to thermal cycling, it can withstand mechanical shock and vibration. It is available in 1/2-pint, pint, quart, gallon and 5-gal pail kits.

MasterSil 151 low-viscosity silicone compound
MasterSil 151 is a two-component, low-viscosity silicone compound suitable for high-performance casting, potting and encapsulation. This formulation can be cured at room temperature with little shrinkage. It has excellent electrical insulation properties and optical clarity. With high tensile strength, an elongation at break of 160%, and a Shore A hardness of 45, it is tough and flexible. It has a dielectric strength of 460 V/mil and an operating temperature range of –65°F to +400°F. MasterSil 151 has a 10-to-1 mix ratio by weight, and its low viscosity assures complete fill-in around complicated contours regardless of configuration. Shelf-life in the original containers is 6 mo when stored at 75°F. This compound is available in half-pint, pint, quart, gallon and 5-gal kits.